About JNTE'2017 > Topics

The symposium will focus on emerging technologies for micro-nanofabrication, from fundamentals to complex integration techniques. It represents a unique opportunity:

  • to gather the scientific community involved in micro-nanotechnology, process engineering, physics and modeling of fabrication processes,
  • to enhance the diffusion of news results and ideas among the main actors, to make new fabrication concepts beneficial to other disciplines,
  • to create a continuity of expertise from fundamental studies on materials, new processing techniques, or modeling, to applied research on process engineering (integration of technologies, development of new micro-nanodevices, etc.),
  • to reinforce the interactions between the main actors of micro-nanotechnology integration (national, or proximity technology platforms, etc.), and between these actors and the scientific community involved in the development of specific processing techniques or characterization tools at a more fundamental stage.

1. Synthesis of materials

Synthesis, growth, or deposition techniques for the integration of new materials, including: thin film materials, semiconductor, organic materials; sol-gel, colloids; nanowires, nanotubes; nano-crystals and nanoparticles; bottom-up approaches for the integration of nano-materials; self-assembly and auto-organization of nano-materials; modeling and characterization methods related to material synthesis and integration.

2. Surface functionnalization and processing

Plasma and chemical grafting of molecules on a surface; surface processing and functionalization for self-assembly, bio-compatibility, modification of the surface properties; laser/matter and plasma/matter interaction; surface preparation methods.

3. Etching – Lithography – Nano-patterning

Plasma and ion beam etching of materials; new chemical or dry etching processes for micro-nanopatterning; new etching techniques; ; plasma physics and plasma-surface interactions related to plasma etching for micro-nanofabrication; simulation and modelling of etching processes; related characterization methods. Electron-beam, deep and extreme UV, nanoimprinting, 3D-lithography, soft lithography techniques, micro-contact printing; new lithography and direct writing techniques based on AFM, near field enhancement, ion beam direct writing; new resists and polymers for high-resolution lithography and new lithography techniques; modelling of lithography process.

4. Integration of technologies

This session will address the integration of new technologies in complex fabrication processes: processing of new components, micro-nanodevices or micro-nanosystems; new bonding techniques for the heterogeneous integration of materials, new substrates for device processing (soft or flexible substrates, ..); integration of organic/inorganic materials, encapsulation methods; integration of bottom-up approaches in device processing (manipulating, connecting nano-objects); integration of micro-technologies for sensing, chemistry and biology.

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